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Demonstration and characterization of Sn-3.0Ag-0.5Cu/Sn-57Bi-1Ag combination solder for 3-D multistack packaging Jo, Yun-Hwan; Lee, Joo-Won; Seo, Sun-Kyoung; Lee, Hyuck-Mo; Han, Hun; Lee, Dong-Chun, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.1, pp.110 - 117, 2008-01 |
무연 솔더와 Ni-Cu 합금 UBM 간의 계면 반응 및 신뢰성에 관한 연구 = Study on the reaction and reliability of Ni-Cu alloy UBM with Pb-free solderslink 한훈; Han, Hun; et al, 한국과학기술원, 2005 |
이온처리된 리드프레임과 EMC와의 접착특성 연구 = A study on adhesion characteristics between Ion-treated leadframe and epoxy molding compoundlink 한훈; Han, Hun; et al, 한국과학기술원, 1997 |
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