Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Byun, KY
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| Analysis on interfacial failures of ultra-fine pitch wire with low inter-metallic coverage Shin, JW; Song, MS; Park, YS; Kwon, YM; Moon, JT; Cho, JS; Yoo, KA; et al, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.942 - 946, 2009-12-09 |
| Effect of Pd addition on ultra-fine pitch Au wire/Al pad interface Shin, JW; Song, MS; Park, YS; Kwon, YM; Moon, JT; Cho, JS; Yoo, KA; et al, 60th Electronic Components and Technology Conference, ECTC 2010, pp.329 - 335, ECTC, 2010-06-01 |
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