Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject peel strength
Showing results 1 to 4 of 4
| (A) study on residual stresses in electroless Ni(P) and Ni(P)/Sn films and peel strengths of Cu/Cr/Polyimide system = 무전해 Ni(P) 및 Ni(P)/Sn 박막의 잔류응력과 Cu/Cr/Polyimide 계의 필강도 해석에 대한 연구link Song, Jae-Yong; 송재용; et al, 한국과학기술원, 2003 |
| Adhesion behavior of CuCr alloy/polyimide films under 350 degrees C and 85 degrees C/85% RH environments Ahn, EC; Yu, Jin; Park, IS; Lee, Won-Jong, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.10, no.12, pp.1343 - 1357, 1996-04 |
| Chemical reaction of sputtered Cu film with PI modified by low energy reactive atomic beam Park, JY; Jung, Yeon Sik; Cho, J; Choi, WK, APPLIED SURFACE SCIENCE, v.252, no.16, pp.5877 - 5891, 2006-06 |
| Effects of the Degree of Cure on the Electrical and Mechanical Behavior of Anisotropic Conductive Films Chung, Chang-Kyu; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.39, pp.410 - 418, 2010-04 |
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