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Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject interfacial reactions

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Showing results 1 to 4 of 4

1
A Study on the Thermal Reliability of Cu/SnAg Double-Bump Flip-Chip Assemblies on Organic Substrates

Son, Ho-Young; Jung, Gi-Jo; Park, Byung-Jin; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.12, pp.1832 - 1842, 2008-12

2
Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy

Jeon, YD; Paik, Kyung-Wook; Ostmann, A; Reichl, H, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.80 - 90, 2005-01

3
Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging

Cho, Moon Gi; Kang, Sung K.; Seo, Sun-Kyoung; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.11, pp.2242 - 2250, 2009-11

4
Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition

Kang, SK; Leonard, D; Shih, DY; Gignac, L; Henderson, DW; Cho, S; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.3, pp.479 - 485, 2006-03

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