Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject interconnections
Showing results 1 to 3 of 3
| Improvement of Device Performance by Optimizing the Advanced DCV Process Condition in Dual-Damascene Cu Interconnects Lee, Min Hyung; Lee, Han Choon; Park, Chul Ho; Han, Jae-Won; Paik, Kyung-Wook, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.156, no.8, pp.644 - 647, 2009-06 |
| Ultrasonic Bonding Using Anisotropic Conductive Films (ACFs) for Flip Chip Interconnection Lee, Ki-Won; Kim, Hyoung-Joon; Yim, Myung-Jin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.32, no.4, pp.241 - 247, 2009-10 |
| Wafer-Level Packages Using Anisotropic Conductive Adhesives (ACAs) Solution for Flip-Chip Interconnections Kim, Il; Jang, Kyung-Woon; Son, Ho-Young; Kim, Jae-Han; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.5, pp.792 - 797, 2011-05 |
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