Showing results 1 to 8 of 8
Adhesion behavior of CuCr alloy/polyimide films under 350 degrees C and 85 degrees C/85% RH environments Ahn, EC; Yu, Jin; Park, IS; Lee, Won-Jong, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.10, no.12, pp.1343 - 1357, 1996-04 |
DEFECT CHARACTERIZATION OF HIGH THERMAL CONDUCTIVITY CaF2 DOPED AlN CERAMICS BY RAMAN SPECTROSCOPY Lee, Hyeon-Keun; Kim, Do Kyung, MODERN PHYSICS LETTERS B, v.23, no.31-32, pp.3869 - 3876, 2009-12 |
Effect of homogenization heat treatment on microstructure and bond strength of high strength Au bonding wire = 고강도 Au bonding wire의 균질화 열처리에 따른 미세조직 및 접합강도 연구link Lim, Byung-Kyu; 임병규; et al, 한국과학기술원, 2006 |
Encapsulated Monoclinic Sulfur for Stable Cycling of Li-S Rechargeable Batteries Moon, San; Jung, Young Hwa; Jung, Wook Ki; Jung, Dae Soo; Choi, Jang Wook; Kim, Do Kyung, ADVANCED MATERIALS, v.25, no.45, pp.6547 - 6553, 2013-12 |
Fabrication and evaluation of Ag/AgCl reference electrode Heo, Yeon-Hyuk; Park, Woon-Ik; Whang, Jung-Suk; Park, Chong-Ook, ELECTRONIC MATERIALS LETTERS, v.3, pp.33 - 38, 2007-03 |
Nanoscale Silver-Based Al-Doped ZnO Multilayer Transparent-Conductive Oxide Films Cho, Hyun-Jin; Park, Kyung-Woo; Ahn, Jun-Ku; Seong, Nak-Jin; Yoon, Soon-Gil; Park, Won-Ho; Yoon, Sung-Min; et al, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.156, no.8, pp.215 - 220, 2009 |
Solution-Processed, High Performance Aluminum Indium Oxide Thin-Film Transistors Fabricated at Low Temperature Hwang, Young-Hwan; Jeon, Jun-Hyuck; Seo, Seok-Jun; Bae, Byeong-Soo, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.12, no.9, pp.336 - 339, 2009 |
Surface hardening of AISI 316L stainless steel using plasma carburizing Suh, BS; Lee, Won-Jong, THIN SOLID FILMS, v.295, no.1-2, pp.185 - 192, 1997-02 |
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