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Contraction stress build-up of anisotropic conductive films (ACFs) for flip-chip interconnection: Effect of thermal and mechanical properties of ACFs Kwon, WS; Paik, Kyung-Wook, JOURNAL OF APPLIED POLYMER SCIENCE, v.93, no.6, pp.2634 - 2641, 2004-09 |
Photocurable transparent cycloaliphatic epoxy hybrid materials crosslinked by oxetane Yang, Seung-Cheol; Jin, Jung-Ho; Kwak, Seung-Yeon; Bae, Byeong-Soo, JOURNAL OF APPLIED POLYMER SCIENCE, v.126, pp.E380 - E386, 2012-11 |
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