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(A) study on the thermal properties of underfill in flip-chip package = 플립칩용 언더필의 열적물성에 관한 연구link Lee, Woong-Sun; 이웅선; et al, 한국과학기술원, 2005 |
Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages Lee, BW; Jang, W; Kim, DW; Jeong, J; Nah, JW; Paik, Kyung-Wook; Kwon, D, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.380, pp.231 - 236, 2004-08 |
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