Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject flip-chip

Showing results 1 to 4 of 4

1
CrCu based UBM (under bump metallization) study with electroplated Pb/63Sn solder bumps - Interfacial reaction and bump shear strength

Jang, SY; Wolf, J; Ehrmann, O; Gloor, H; Schreiber, T; Reichl, H; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.26, no.1, pp.245 - 254, 2003-03

2
Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications

Yim, MJ; Ryu, W; Jeon, YD; Lee, J; Ahn, Seungyoung; Kim, Joungho; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.22, no.4, pp.575 - 581, 1999-12

3
(UBM)Under bump metallurgy study for Pb-free bumping

Jang, SY; Wolf, J; Gloor, H; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.478 - 487, 2002-05

4
광모듈에 실장되는 광·전소자의 저온 및 멀티 플립칩 본딩에 관한 연구 = Low temperature and multiple flip-chip bonding of optoelectronic chips for optical moduleslink

주건모; Chu, Kun-Mo; et al, 한국과학기술원, 2007

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