Showing results 1 to 3 of 3
Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties and Bending Reliability of Flex-on-Flex Assembly Kim, Tae-Wan; Lee, Tae-Ik; Pan, Yan; Kim, Wansun; Zhang, Shuye; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.9, 2016-09 |
Effects of Flux Activator Addition in Nanofiber/Solder Anisotropic Conductive Films (ACFs) on the Solder Wettability of Flex-on-Flex (FOF) Assembly Lee, Ji-Soo; Kim, Ji-Hye; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.7, pp.1316 - 1322, 2018-07 |
Study on Fine Pitch Flex-on-Flex Assembly Using Nanofiber/Solder Anisotropic Conductive Film and Ultrasonic Bonding Method Lee, Sang-Hoon; Suk, Kyoung-Lim; Lee, Ki-Won; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.12, pp.2108 - 2114, 2012-12 |
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