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A study on Flex-on-Fabric (FOF) Interconnection Using Anisotropic Conductive Films (ACFs) and Ultrasonic Bonding Method Jung, Seung-Yoon; Hong, Hye-Eun; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1265 - 1271, 2017-08 |
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