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Showing results 1 to 6 of 6

1
(A) Study on the Reliability of VLSI Nano-Interconnections = VLSI 나노배선의 신뢰성에 관한 연구link

Lee, Min-Hyung; 이민형; et al, 한국과학기술원, 2010

2
(An) advanced statistical model for the lifetime prediction due to electromigration failure and an improved fast method for the reliability evaluation in metal lines = Electromigration으로 단선되는 금속배선의 수명을 예측하기 위한 진보된 통계적 모델링과 신뢰성 측정 방법 개선에 관한 연구link

Park, Jong-Ho; 박종호; et al, 한국과학기술원, 2003

3
Electromigration in flip chip solder bump of 97Pb-3Sn/37Pb-63Sn combination structure

Nah, JW; Kim, JH; Lee, HyuckMo; Paik, Kyung-Wook, ACTA MATERIALIA, v.52, no.1, pp.129 - 136, 2004-01

4
Electromigration Reliability of Barrierless Ruthenium and Molybdenum for Sub-10 nm Interconnection

Kim, Jungkyun; Rhee, Hakseung; Son, Myeong Won; Park, Juseong; Kim, Gwangmin; Song, Hanchan; Kim, Geunwoo; et al, ACS APPLIED ELECTRONIC MATERIALS, v.5, no.5, pp.2447 - 2453, 2023-04

5
Studies on solder bumps coining processes and reliability of assembled flip chip = 솔더 범프 코이닝 공정 및 플립칩 접속 후 신뢰성에 관한 연구link

Nah, Jae-Woong; 나재웅; et al, 한국과학기술원, 2004

6
β-Sn grain orientations in Pb-free solders and their effect on the reliability of solder joints = 무연 솔더의 β-Sn 결정립 방향성과 솔더 조인트 신뢰성에 미치는 영향link

Seo, Sun-Kyoung; 서선경; et al, 한국과학기술원, 2010

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