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Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject electroless Ni

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Showing results 1 to 4 of 4

1
A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy

Jeon, YD; Nieland, S; Ostmann, A; Reichl, H; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.32, pp.548 - 557, 2003-06

2
Stresses in electroless Ni-P films for electronic packaging applications

Jeon, YD; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.25, no.1, pp.169 - 173, 2002-03

3
Studies of electroless nickel under bump metallurgy-solder interfacial reactions and their effects on flip chip solder joint reliability

Jeon, YD; Paik, Kyung-Wook; Bok, KS; Choi, WS; Cho, CL, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.520 - 528, 2002-05

4
Studies of electroless nickel under bump metallurgy—Solder interfacial reactions and their effects on flip chip solder joint reliability

Jeon, Young Doo; Paik, Kyung Wook; Bok, Kyoung Soon; Choi, Woo Suk; Cho, Chul Lae, Journal of Electronic Materials v.31 n.5, 520-528, 2000-01

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