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Effect of deposition pressure on bonding nature in hydrogenated amorphous carbon films processed by electron cyclotron resonance plasma enhanced chemical vapor deposition Ryu, Ho Jin; Kim, SH; Hong, Soon-Hyung, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.277, no.1-2, pp.57 - 63, 2000-01 |
Effect of the pressure on the chemical vapor deposition of copper from copper hexafluoroacetylacetonate trimethylvinylsilane Lee, WJ; Rha, SY; Lee, SY; Kim, DW; Park, Chong-Ook, THIN SOLID FILMS, v.305, pp.254 - 258, 1997-01 |
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