Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject current carrying capacity1. IntroductionFlip chip technology has been widely used to meet the package requirements of increasing density and higher electrical performance for electro
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| Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity 임명진; 김형준; 백경욱, 마이크로전자 및 패키징학회지, v.12, no.1, pp.9 - 16, 2005-03 |
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