Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject Pb-free solders
Showing results 1 to 6 of 6
| Effects of Zn addition on undercooling of Pb-free solder alloys and their interfacial reactions with Cu and Ni-P UBMs = 무연 솔더 합금의 과냉도 및 하부 금속층과의 계면 반응에 미치는 솔더 내 미량 Zn 첨가의 영향link Cho, Moon-Gi; 조문기; et al, 한국과학기술원, 2009 |
| Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging Cho, Moon Gi; Kang, Sung K.; Seo, Sun-Kyoung; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.11, pp.2242 - 2250, 2009-11 |
| Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition Kang, SK; Leonard, D; Shih, DY; Gignac, L; Henderson, DW; Cho, S; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.3, pp.479 - 485, 2006-03 |
| Microstructural discovery of Al addition on Sn-0.5Cu-based Pb-free solder design Koo, Jahyun; Lee, Changsoo; Hong, Sung Jea; Kim, Keun-Soo; Lee, Hyuck-Mo, JOURNAL OF ALLOYS AND COMPOUNDS, v.650, pp.106 - 115, 2015-11 |
| New Sn-0.7Cu-based solder alloys with minor alloying additions of Pd, Cr and Ca Koo, Jahyun; Chang, Jaewon; Lee, Young Woo; Hong, Sung Jea; Kim, Keun-Soo; Lee, Hyuck Mo, JOURNAL OF ALLOYS AND COMPOUNDS, v.608, pp.126 - 132, 2014-09 |
| The Crystal Orientation of beta-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy Seo, Sun-Kyoung; Kang, Sung K.; Cho, Moon Gi; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.12, pp.2461 - 2469, 2009-12 |
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