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Improving accuracy of filling performance prediction in microvia copper electroplating Moon, Jeong-Ho; Shin, Jaewook; Kim, Tae-Hee; Song, DongHoon; Cho, EunAe, JOURNAL OF ELECTROANALYTICAL CHEMISTRY, v.871, 2020-08 |
PEG/PEG-$SO_3^-$를 함유한 항응혈성 중합체의 합성 및 그 특성 = PEG/PEG-$SO_3^-$ containing polymers as thromboresistant materialslink 이희정; Lee, Hee-Jung; et al, 한국과학기술원, 1997 |
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