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Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject Non-conductive films (NCFs)▼aMicro bump▼aSolder joint▼aThermo-Compression▼aThermo-mechanical reliability

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(A) study on the effects of the curing behavior and viscosities of non-conductive films (NCFs) on flip chip solder joint morphology and reliability = 비전도성 필름(NCFs)의 경화 거동과 점도가 플립칩 어셈블리의 솔더 조인트 형상 및 신뢰성에 미치는 영향에 대한 연구link

Lee, HanMin; Paik, Kyoung-Wook; et al, 한국과학기술원, 2020

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