Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject Non-conductive film (NCF)▼amoisture▼aadhesion strength▼aCu-pillar/Sn-Ag bump▼ametal surface finish▼ainterfacial reliability▼asolder resist▼aconing▼aCOB assembly
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| Effects of non-conductive film (NCF) and substrate materials properties on the reliability of chip-on-board assembly = NCF와 Substrate 특성이 COB 패키지 신뢰성에 미치는 영향에 대한 연구link Kim, Youngsoon; Paik, Kyoung-Wook; et al, 한국과학기술원, 2016 |
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