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Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject Non-conductive adhesive films(NCFs)▼aUltra fine pitch micro bump▼aHigh speed thermo-compression bonding▼aThermo-compression gang bonding▼aSolder joint morphology

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(A) study on effects of non-conductive films(NCFs) material properties and bonding parameters on Cu-pillar/Sn-Ag hybrid bump interconnection using thermo-compression bonding = 구리/주석-은 하이브리드 범프 접합시 열압착 접합 공정에서 비전도성 접속 필름의 물성과 접합 변수의 영향에 대한 연구link

Jang, Min-Gu; Paik, Kyung-Wook; et al, 한국과학기술원, 2020

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