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Showing results 1 to 10 of 10

1
50Pb50In wt% 소더의 Cu, Ni 기판 위에서의 wetting 특성 = Wetting characteristics of 50Pb50In wt% solder on Cu, Ni substrateslink

정영희; Jung, Young-Hy; 유진; 전덕영; et al, 한국과학기술원, 1998

2
(A) study on the interfacial reaction between lead-free solders and electroplated Ni or Cu metallization and its effect on mechanical reliability = 무연솔더와 전기도금된 니켈 및 구리와의 계면반응과 기계적 신뢰성에 미치는 영향에 관한 연구link

Kim, Jong-Yeon; 김종연; et al, 한국과학기술원, 2008

3
Fabrication Process and Electromagnetic Wave Absorption Characterization of a CNT/Ni/Epoxy Nanocomposite

Ryu, Seongwoo; Mo, Chan Bin; Lee, Haeshin; Hong, Soon-Hyung, JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.13, no.11, pp.7669 - 7674, 2013-11

4
Photoelectrochemical analysis of passive films formed on Ni and its alloys and its application to their corrosion behaviors

Jang, HeeJin; Kwon, HyukSang, JOURNAL OF SOLID STATE ELECTROCHEMISTRY, v.19, no.12, pp.3427 - 3438, 2015-12

5
Photoelectrochemical analysis on the passive film formed on Ni in pH 8.5 buffer solution

Jang, HJ; Park, CJ; Kwon, Hyuk-Sang, ELECTROCHIMICA ACTA, v.50, pp.3503 - 3508, 2005-05

6
Repetitive grain growth behavior with increasing temperature and grain boundary roughening in a model nickel system

Jung, Sang Hyun; Kang, Suk-Joong L., ACTA MATERIALIA, v.69, pp.283 - 291, 2014-05

7
Sn 솔더볼과 Ni 기판간의 계면 현상 및 열역학적 고찰 = Thermodynamic study and the interfacial phenomena of the Sn solder ball on the Ni substratelink

김종훈; Kim, Jong-Hoon; et al, 한국과학기술원, 2000

8
단순한 봉형상 및 모양변화를 보이는 봉형상 초합금 주물의 일방향 주조시 응고해석 = A numerical analysis for directional solidification of simple and complex rod shape superalloy castinglink

최윤석; Choi, Yun-Suk; et al, 한국과학기술원, 1998

9
저압 다이아몬드 합성에서 Ni, Fe, Co, Pd 기판에서 형성되는 soot 형성기구와 합성 조건에 따른 다이아몬드의 성장 모양 변화 = Mechanism of soot-formation on Ni, Fe, Co and Pd substrates, and morphology variation of diamond with deposition conditions in CVD of diamondlink

허종무; Huh, Jong-Moo; et al, 한국과학기술원, 2000

10
표면 산화층이 서브마이크론 크기 니켈의 소결거동에 미치는 영향 = Effect of passivation on the sintering behavior of submicron nickel powder compactslink

조기영; Jo, Gi-Young; et al, 한국과학기술원, 2013

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