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Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject Next-generation semiconductor package▼aThermal dissipation▼aEpoxy molding compound (EMC)▼aThermal conductivity▼aThermal diffusivity▼aSigmoidal curve response▼aPolymer-filler system▼aHill-langmuir equation

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Study on thermal conductivity model of polymer composite material for next-generation semiconductor package = 차세대 반도체 패키지를 위한 고분자 복합재료의 열전도도 모델 규명에 관한 연구link

Kim, Nam Jun; 김남준; et al, 한국과학기술원, 2024

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