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Effect of catalyst for nickel films for NiSi formation with improved interface roughness Kang, Hee-Sung; Ha, Jong-Bong; Lee, Jung-Hee; Choi, Chi Kyu; Lee, JeongYong; Lee, Kwang-Man, THIN SOLID FILMS, v.519, pp.6658 - 6661, 2011-08 |
구리 CECVD를 이용한 3-D packaging용 through-Si via/trench filling에 대한 연구 = Through-Si via/trench filling for 3-D packaging by copper catalyst-enhanced chemical vapor depositionlink 이도선; Lee, Do-Seon; et al, 한국과학기술원, 2009 |
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