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Effect of Flux Activators on the Solder Wettability of Solder Anisotropic Conductive Films Kim, Seung-Ho; Choi, Yongwon; Kim, Yoo Sun; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.1, pp.3 - 8, 2015-01 |
Effects of metal stacks and patterned metal profiles on the electromigration characteristics in super-thin AlCu interconnects for sub-0.13 mu m technology Lee, Min-Hyung; Kwon, Yong-Min; Pyo, Sung-Gyu; Lee, Han-Choon; Han, Jae-Won; Paik, Kyung-Wook, THIN SOLID FILMS, v.519, no.11, pp.3906 - 3913, 2011-03 |
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