Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject Flip chip▼aThrough silicon via (TSV)▼aNon-conductive film (NCF)▼aGlass Circuit Board (GCB)▼aThrough glass via (TGV)
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| (A) study on fabrication of the glass circuit board (GCB) and its ultra-fine pitch flip chip assembly using non-conductive films (NCFs) = 비전도성 접합필름을 이용한 초미세 피치 플립칩과 유리회로기판 제작에 관한 연구link Cho, Se-Min; Paik, Kyoung-Wook; et al, 한국과학기술원, 2016 |
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