Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject FLIP-CHIP
Showing results 1 to 17 of 17
| A Study on the Failure Mechanism and Enhanced Reliability of Sn58Bi Solder Anisotropic Conductive Film Joints in a Pressure Cooker Test Due to Polymer Viscoelastic Properties and Hydroswelling Zhang, Shuye; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.2, pp.216 - 223, 2016-02 |
| Chip warpage damage model for ACA film type electronic packages Yang, SY; Kwon, WS; Lee, Soon-Bok; Paik, Kyung-Wook, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4, 2005 |
| Comparative study of thermally conductive fillers in underfill for the electronic components Lee, WS; Yu, Jin, DIAMOND AND RELATED MATERIALS, v.14, no.10, pp.1647 - 1653, 2005-10 |
| Effect of phosphorous content on phase transformation induced stress in Sn/Ni(P) thin films Song, JY; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.21, no.9, pp.2261 - 2269, 2006-09 |
| Effects of ACF Bonding Parameters on ACF Joint Characteristics for High-Speed Bonding Using Ultrasonic Bonding Method Kim, Yoo-Sun; Lee, Ki-Won; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.1, pp.177 - 182, 2013-01 |
| Effects of Bonding Pressures and Bonding Temperatures on Solder Joint Morphology and Reliability of Solder ACF Bonding Kim, Yoo Sun; Kim, Seung-Ho; Shin, Ji Won; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.9, pp.1350 - 1357, 2015-09 |
| Effects of Polyacrylonitrile Anchoring Polymer Layer Solder Anisotropic Conductive Films on the Solder Ball Movement for Fine-Pitch Flex-on-Flex (FOF) Assembly Yoon, Dal Jin; Lee, Sang-Hoon; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.5, pp.830 - 835, 2019-05 |
| Effects of the Degree of Cure on the Electrical and Mechanical Behavior of Anisotropic Conductive Films Chung, Chang-Kyu; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.39, pp.410 - 418, 2010-04 |
| Effects of thermal cycling on material properties of nonconductive pastes (NCPs) and the relationship between material properties and warpage behavior during thermal cycling Jang, Kyung-Woon; Kim, Hyoung-Joon; Chung, Chang-Kyu; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.31, no.3, pp.559 - 565, 2008-09 |
| Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs) Suk, Kyoung-Lim; Son, Ho-Young; Chung, Chang-Kyu; Kim, Joong-Do; Lee, Jin-Woo; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.52, no.1, pp.225 - 234, 2012-01 |
| Implantable Micro-Light-Emitting Diode (mu LED)-based optogenetic interfaces toward human applications Lee, Jae Hee; Lee, Sinjeong; Kim, Daesoo; Lee, Keon Jae, ADVANCED DRUG DELIVERY REVIEWS, v.187, 2022-08 |
| Moisture induced interface weakening in ACF package Sim, Gidong; Chung, Chang-Kyu; Paik, Kyung-Wook; Lee, Soon-Bok, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.528, no.2, pp.698 - 705, 2010-12 |
| Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications Yim, MJ; Paik, Kyung-Wook, INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, v.26, pp.304 - 313, 2006-08 |
| Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs) Suk, Kyoung-Lim; Choo, Kyo-Sung; Kim, Sung-Jin; Kim, Jong-Soo; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.52, no.6, pp.1182 - 1188, 2012-06 |
| Theoretical prediction and experimental measurement of the degree of cure of anisotropic conductive films (ACFs) for chip-on-flex (COF) applications Chung, Chang-Kyu; Kwon, Yong-Min; Kim, Il; Son, Ho-Young; Choo, Kyo-Sung; Kim, Sung-Jin; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.10, pp.1580 - 1590, 2008-10 |
| Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition Jang, Jae-Won; Suk, Kyoung-Lim; Park, Jin-Hyoung; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.7, pp.1144 - 1151, 2014-07 |
| 무전해 니켈 UBM을 이용한 여러 솔더 범프의 계면 반응 및 신뢰성에 관한 연구 = Studies on interfacial reactions and reliabilities of various solder bumps on electroless Ni-P UBMslink 전영두; Jeon, Young-Doo; et al, 한국과학기술원, 2004 |
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