DSpace at KOASAS
Browsing DSpace

Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject Diffusion

A to Z

All 0-9

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

or enter first few letters:

Showing results 1 to 7 of 7

1
Al/Ti 합금의 브레이징 기구와 계면특성 = Brazing mechanism and interface characteristics of Al/Ti brazed alloyslink

봉하헌; Bong, Ha-Heon; 홍순형; Hong, Soon-Hyung; et al, 한국과학기술원, 1999

2
Effects of residual S on Kirkendall void formation at Cu/Sn-3.5Ag solder joints

Yu, Jin; Kim, J. Y., ACTA MATERIALIA, v.56, no.19, pp.5514 - 5523, 2008-11

3
Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn-3.5Ag solder joints

Kim, J. Y.; Yu, Jin; Kim, Sung-Hwan, ACTA MATERIALIA, v.57, pp.5001 - 5012, 2009-10

4
Effects of the Kirkendall Voiding on the Interfacial Reactions between Pb-free Solders and Electroplated Cu Film and Suppression of the Kirkendall Voiding in the Solder Joints = 전기도금된 구리와 무연솔더의 접합에서 Kirkendall void가 계면 반응에 미치는 영향과 Kirkendall void의 억제에 관한 연구link

Kim, Sung-Hwan; 김성환; et al, 한국과학기술원, 2012

5
Nanoscale austenite reversion through partitioning, segregation and kinetic freezing: Example of a ductile 2 GPa Fe-Cr-C steel

Yuan, L.; Ponge, D.; Wittig, J.; Choi, Pyuck-Pa; Jimenez, J. A.; Raabe, D., ACTA MATERIALIA, v.60, no.6-7, pp.2790 - 2804, 2012-04

6
Recrystallization-induced void migration in electroplated Cu films

Kim, Sung-Hwan; Yu, Jin, SCRIPTA MATERIALIA, v.67, no.4, pp.312 - 315, 2012-08

7
분자동역학을 이용한 CNT에 지지된 Au와 Pt 나노클러스터의 거동에 관한 연구 = Molecular dynamics simulation of the diffusion of Au and Pt nanocluster on CNTlink

서동화; Seo, Dong-Hwa; et al, 한국과학기술원, 2009

Discover

rss_1.0 rss_2.0 atom_1.0