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Showing results 1 to 6 of 6

1
Barrier properties and failure mechanism of Ta-Si-N thin films for Cu interconnection

Lee, YJ; Suh, BS; Kwon, MS; Park, Chong-Ook, JOURNAL OF APPLIED PHYSICS, v.85, no.3, pp.1927 - 1934, 1999-02

2
Crystallization of amorphous WNx films

Suh, BS; Cho, HK; Lee, YJ; Lee, WJ; Park, Chong-Ook, JOURNAL OF APPLIED PHYSICS, v.89, no.7, pp.4128 - 4133, 2001-04

3
Field emission characteristics of CoSi2/TiN-coated silicon emitter tips

Han, BW; Lee, HS; Ahn, Byung Tae, APPLIED SURFACE SCIENCE, v.187, no.1-2, pp.45 - 50, 2002-02

4
Plasma-enhanced ALD of titanium-silicon-nitride using TiCl4, SiH4, and N-2/H-2/Ar plasma

Park, JS; Kang, SW, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.7, no.8, pp.C87 - C89, 2004

5
Structural and chemical stability of Ta-Si-N thin film between Si and Cu

Lee, YJ; Suh, BS; Rha, SK; Park, Chong-Ook, THIN SOLID FILMS, v.320, no.1, pp.141 - 146, 1998-05

6
The Mechanism of Si Incorporation and the Digital Control of Si Content during the Metallorganic Atomic Layer Deposition of Ti-Si-N Thin Films

Min, Jae-Sik; Park, Jin-Seong; Park, Hyung-Sang; Kang, Sang-Won, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.147, no.10, pp.3868 - 3872, 2000-06

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