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Showing results 1 to 4 of 4

1
A chemical reaction path design for the atomic layer deposition of tantalum nitride thin films

Kwon, Jung-Dae; Park, Jin-Seong; Lee, Han-Choon; Kang, Sang-Won, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.9, no.9, pp.G282 - G284, 2006-06

2
Effect of the microstructureOf Si3N4 on the adhesion strength of TiN film on Si3N4

Kim, YG; Tatami, J; Komeya, K; Kim, Do Kyung, THIN SOLID FILMS, v.510, pp.222 - 228, 2006-07

3
MOCVD of Titanium Nitride from a New Precursor Ti[N(CH3)C2H5]4

Shin, HK; Shin, HJ; Lee, JG; Kang, SW; Ahn, Byung Tae, CHEMISTRY OF MATERIALS, v.9, no.1, pp.76 - 80, 1997-01

4
PERFORMANCE OF THE PLASMA-DEPOSITED TUNGSTEN NITRIDE BARRIER TO PREVENT THE INTERDIFFUSION OF AL AND SI

LEE, CW; KIM, YT; LEE, C; Lee, JeongYong; MIN, SK; PARK, YW, JOURNAL OF VACUUM SCIENCE TECHNOLOGY B, v.12, no.1, pp.69 - 72, 1994-01

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