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In-situ isothermal aging TEM analysis of a micro Cu/ENIG/Sn solder joint for flexible interconnects Liu, Jinhong; Xu, Jianhao; Paik, Kyung-Wook; He, Peng; Zhang, Shuye, JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, v.169, pp.42 - 52, 2024-01 |
Reliability analysis of 3D CSP MEMS and IC under thermal cycle-impact coupled multi-physics loads Zhang, Shuye; Xu, Jianhao; Zhang, Shang; He, Peng; Sun, Mingjia; Yang, Jianqun; Li, Xingji; et al, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), IEEE, 2021-06 |
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