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Fine pitch flex-on-flex (FOF) assembly using nanofiber solder anisotropic conductive films (ACFs) and ultrasonic bonding method Lee, Sang Hoon; Suk, Kyung Lim; Paik, Kyung-Wook, The 63rd Electronic Components and Technology Conference, pp.1709 - 1712, The 63rd Electronic Components and Technology Conference, 2013-05-29 |
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