Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Son, Ho-Young
Showing results 1 to 11 of 11
| A Study on the Thermal Reliability of Cu/SnAg Double-Bump Flip-Chip Assemblies on Organic Substrates Son, Ho-Young; Jung, Gi-Jo; Park, Byung-Jin; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.12, pp.1832 - 1842, 2008-12 |
| Bildsensormodul und Verfahren zu seiner Herstellung Paik, Kyung-Wook; Yim, Myung-Jin; Son, Ho-Young; Kwon, Yong-Min |
| Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs) Suk, Kyoung-Lim; Son, Ho-Young; Chung, Chang-Kyu; Kim, Joong-Do; Lee, Jin-Woo; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.52, no.1, pp.225 - 234, 2012-01 |
| Method of manufacturing organic substrate with embedded active chip Paik, Kyung-Wook; Son, Ho-Young |
| Novel Wafer Level Packages Using Anisotropic Conductive Pastes (ACPs) and NCPs Paik, Kyung-Wook; Kim, Il; Son, Ho-Young; Chung, Chang-Kyu, Novel Wafer Level Packages Using Anisotropic Conductive Pastes (ACPs) and NCPs, pp.0 - 0, 2008 |
| Studies on assembly and reliability of Cu/SnAg double-bump flip chip on organic substrates for fine pitch applications = Cu/SnAg 더블 범프를 이용한 미세 피치 플립칩 접속 및 신뢰성에 관한 연구link Son, Ho-Young; 손호영; et al, 한국과학기술원, 2008 |
| Theoretical prediction and experimental measurement of the degree of cure of anisotropic conductive films (ACFs) for chip-on-flex (COF) applications Chung, Chang-Kyu; Kwon, Yong-Min; Kim, Il; Son, Ho-Young; Choo, Kyo-Sung; Kim, Sung-Jin; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.10, pp.1580 - 1590, 2008-10 |
| Thermal cycling reliability of Cu/SnAg double-bump flip chip assemblies for 100 mu m pitch applications Son, Ho-Young; Kim, Ilho; Lee, Soon-Bok; Jung, Gi-Jo; Park, Byung-Jin; Paik, Kyung-Wook, JOURNAL OF APPLIED PHYSICS, v.105, no.1, 2009-01 |
| Wafer Level Package Using Pre-Applied Anisotropic Conductive Films(ACFs) Son, Ho-Young; Chung, Chang-Kyu; Paik, Kyung-Wook, 2007 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, pp.0 - 0, 2007-01 |
| Wafer-Level Packages Using Anisotropic Conductive Adhesives (ACAs) Solution for Flip-Chip Interconnections Kim, Il; Jang, Kyung-Woon; Son, Ho-Young; Kim, Jae-Han; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.5, pp.792 - 797, 2011-05 |
| 잉크젯 방식을 이용한 공정 납/주석 솔더 범프의 형성에 관한 연구 = Studies on fabrication of jetted eutectic Pb/Sn solder bumpslink 손호영; Son, Ho-Young; et al, 한국과학기술원, 2003 |
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