Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Sohn, YC
Showing results 1 to 18 of 18
| A comparative study of ENIG and Cu OSP surface finishes on the mechanical reliability of Sn-3.0Ag-0.5Cu and Sn-36.8Pb-0.4Ag solders Jee, YK; Sohn, YC; Yu, Jin; Lee, TY; Seo, HN; Kim, KH; Ahn, JH; et al, 2006 International Conference on Electronic Materials and Packaging, EMAP, pp.571 - 579, 2006-12-11 |
| Comparison between Electroless Ni(P)Au and Cu OSP as a Surface Finish Layer of Mobile Application Yu, Jin; Sohn, YC; Jee, YK; Seo, HS; Kim, KH; Ahn, JH; Lee, YM, IMAPS 2005 Proceedings, 2005 |
| Correlation between chemical reaction and brittle fracture found in electroless Ni(P)/immersion gold-solder interconnection Sohn, YC; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.20, no.8, pp.1931 - 1934, 2005-08 |
| Creep Deformation Behaviors of Tin Pest Resistant Solder Alloys Yu, Jin; Kim, SB; Sohn, YC, ICEP 2005, pp.196 - 201, 2005 |
| Effect of Cu content on the mechanical reliability of Ni/Sn-3.5Ag system Kim, JY; Sohn, YC; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.22, no.3, pp.770 - 776, 2007-03 |
| Effect of intermetallics spalling on the mechanical behavior of electroless Ni(P)/Pb-free solder interconnection Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, 55th Electronic Components and Technology Conference, ECTC 2005, v.1, pp.83 - 88, 2005-05-31 |
| Effects of phosphorus content on the reaction of electroless Ni-P with Sn and crystallization of Ni-P Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Choi, WK, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.7, pp.790 - 795, 2004-07 |
| Impact Reliabilities of Lead-free Solder Joints with Ni(P), Cu and Ni metallizations Yu, Jin; Sohn, YC; Kim, JY; Jee, YK; Ko, YH, ICEP 2006, 2006 |
| Interfacial reactions between CuxNiy alloy underbump metallurgy and Sn-Ag-zCu solders Han, H; Sohn, YC; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.36, no.5, pp.578 - 586, 2007-05 |
| Interfacial Reactions between Lead-free Solders and Ni/Cu Dual-layer UBM Yu, Jin; Kim, JY; Sohn, YC, Micro System Technologies 2005 Proceedings, pp.337 - 344, 2005 |
| Intrinsic stress measurements in CVD diamond films Yu, Jin; Kim, JG; Sohn, YC; Lee, YS, Symposium-Amorphous and Nanoestructured Carbon, pp.471 - 476, MRS, 1999-11-29 |
| Overview of the Electronic Packaging Technologies in Korea Yu, Jin; Sohn, YC; Kim, JI, ICEP 2005, pp.4 - 8, 2005 |
| Spalling behaviors of intel-metallic compounds during the etting reaction of Sn(3.5Ag) on electroless Ni-P metallization Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, Proceedings of 2004 International IEEE Conference on Asian Green Electronics (AGEC), pp.177 - 181, 2004-01-05 |
| Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, JOURNAL OF MATERIALS RESEARCH, v.19, no.8, pp.2428 - 2436, 2004-08 |
| Study of spalling behavior of Intel-metallic compounds during the reaction between electroless Ni-P metallization and lead-free solders Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, 2004 Proceedings - 54th Electronic Components and Technology Conference, v.1, pp.75 - 81, 2004-06-01 |
| Study of the reaction mechanism between electroless Ni-P and Sn and its effect on the crystallization of Ni-P Sohn, YC; Yu, Jin; Kang, SK; Choi, WK; Shih, DY, JOURNAL OF MATERIALS RESEARCH, v.18, no.1, pp.4 - 7, 2003-01 |
| 무전해 Ni-P막의 P함량 변화에 따른 Sn과의 반응 메커니즘 연구 유진; Sohn, YC; Kang, SK; Shih, DY; Choi, WK, 한국마이크로전자 및 패키징학회지, pp.88 - 93, 2003 |
| 화학증착법으로 제조한 다이아몬드막의 고유응력에 대한 탄성/크리프 해석(An Elastic/Plastic Analysis of The Intrinsic Stresses in CVD Diamond Films) 유진; Kim, JK; Sohn, YC, Conf. Mech. Beh. Maters., pp.301 - 310, 2000 |
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