Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Seo, Sun Kyung
Showing results 1 to 3 of 3
| A Novel Double Layer NCF for Highly Reliable Micro-Bump Interconnection Shin, Ji-Won; Choi, Yong-Won; Kim, Young Soon; Kang, Un Byung; Seo, Sun Kyung; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-28 |
| A Novel Fine Pitch TSV Interconnection Method Using NCF with Zn Nano -particles Shin, Ji-Won; Choi, Yong-Won; Kim, Young Soon; Kang, Un Byung; Seo, Sun Kyung; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-28 |
| Effects of Thermo-compression Bonding Parameters on Joint Formation of Micro-bumps in Non-conductive Film (NCF) Shin, Ji-Won; Kim, Young Soon; Lee, Hyoung Gi; Kang, Un Byung; Seo, Sun Kyung; Paik, Kyung-Wook, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-28 |
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