Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Seo, HS

Showing results 1 to 7 of 7

1
A quantitative analysis of the stress relaxation effect of thermoplastics in multilayer substrates

Kim, JS; Paik, Kyung-Wook; Seo, HS, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.22, no.4, pp.638 - 641, 1999-11

2
Biaxial stress analysis in laminated polymer films on silicon substrates for MCM-D application

Kim, JS; Paik, Kyung-Wook; Seo, HS; Oh, SH, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.33, pp.142 - 147, 1998-11

3
Comparison between Electroless Ni(P)Au and Cu OSP as a Surface Finish Layer of Mobile Application

Yu, Jin; Sohn, YC; Jee, YK; Seo, HS; Kim, KH; Ahn, JH; Lee, YM, IMAPS 2005 Proceedings, 2005

4
Internal pressure effect on cathodoluminescence enhancement of ZnS : Mn2+ synthesized by a sealed vessel

Park, BJ; Im, WB; Chung, WJ; Seo, HS; Ahn, JT; Jeon, DukYoung, JOURNAL OF MATERIALS RESEARCH, v.22, no.10, pp.2838 - 2844, 2007-10

5
The development of red emitting ZnS:Cu,Cl,Mn,Te AC powder electroluminescent (ACPEL) phosphor

Park, BJ; Han, JY; Jeon, Duk Young; Seo, HS; Ahn, JT; Oh, DK; Park, SH; et al, 16th International Display Workshops, IDW '09, v.1, pp.379 - 381, 2009-12-09

6
Thermo-Mechanical Stresses in Laminated Polymer Films on Silicon Substrates

Paik, KW; Kim, JS; Oh, SH; Seo, HS, 제5회 한국반도체 학술대회, pp.587 - 588, 한국반도체 학술대회, 1998-02-01

7
Thermo-Mechanical Stresses in Laminated Polymer Films on Silicon Substrates

Paik, Kyung-Wook; Kim, JS; Oh, SH; Seo, HS, International Conference and Exhibition on Multichip Modules and High Density Packaging, pp.449 - 453, International Conference and Exhibition on Multichip Modules and High Density Packaging, 1998-04-01

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