Showing results 1 to 2 of 2
High Power and High Reliability Flex-On-Board Assembly Using Solder Anisotropic Conductive Films Combined with Ultrasonic Bonding Technique Lee, Ki-Won; Saarinen, Ilkka J.; Pykari, Lasse; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.12, pp.1901 - 1907, 2011-12 |
Ultrasonic Bonding of Anisotropic Conductive Films Containing Ultrafine Solder Balls for High-Power and High-Reliability Flex-On-Board Assembly Kim, Won-Chul; Lee, Ki-Won; Saarinen, Ilkka J.; Pykari, Lasse; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.5, pp.884 - 889, 2012-05 |
Discover