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Comparison of Ni-filled Balls and Au-coated Polymer Balls in High-frequency Application of ACF flip-chip Joint Paik, Kyung-Wook; Ahn, Seung Young; Rhu, Woong Hwan; Yim, Myung-Jin; Lee, Jun Ho; Jeon, Young-Doo; Kim, Woo Poung; et al, APACK'99 Symposium on Advances in Packaging, pp.353 - 356, 1999-12-01 |
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