Showing results 1 to 4 of 4
Electromigration in Flip Chip Solder Bump of 97Pb-3Sn/37Pb-63Sn Combination Structure Nah, Jae-Woong; Kim, Jong Hoon; Lee, Hyuck-Mo; Paik, Kyung-Wook, 133rd TMS Annual Meeting, 133rd TMS Annual Meeting, 2004-03 |
Studies on solder bumps coining processes and reliability of assembled flip chip = 솔더 범프 코이닝 공정 및 플립칩 접속 후 신뢰성에 관한 연구link Nah, Jae-Woong; 나재웅; et al, 한국과학기술원, 2004 |
Three-Dimensional a-Si:H Solar Cells on Glass Nanocone Arrays Patterned by Self-Assembled Sn Nanospheres Kim, Jeehwan; Hong, Augustin J.; Nah, Jae-Woong; Shin, Byungha; Ross, Frances M.; Sadana, Devendra K., ACS NANO, v.6, no.1, pp.265 - 271, 2012-01 |
레이저 간섭계(ESPI)를 이용한 플립칩 패키지의 열변형 평가 Paik, Kyung-Wook; Jang, Woo-Soon; Lee, Baik-Woo; Kim, Dong-Won; Jeong, Jeung-Hyun; Kwon, Dong-Il; Nah, Jae-Woong, 대한금속∙재료학회지, v.40, no.9, pp.995 - 1000, 2002-09 |
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