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Demonstration and characterization of Sn-3.0Ag-0.5Cu/Sn-57Bi-1Ag combination solder for 3-D multistack packaging Jo, Yun-Hwan; Lee, Joo-Won; Seo, Sun-Kyoung; Lee, Hyuck-Mo; Han, Hun; Lee, Dong-Chun, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.1, pp.110 - 117, 2008-01 |
전자패키징용 복합 솔더에서 Cu/Ni 비율에 따른 금속간 화합물의 형성과 특성 평가에 관한 연구 = A Study of the effect of the Cu/Ni ratio on formation of intermetallic compounds and evaluation of reliability in the Cu-Ni-bearing composite solderslink 이주원; Lee, Joo-Won; et al, 한국과학기술원, 2006 |
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