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Showing results 1 to 4 of 4

1
Comparative study of drop reliability between Cu and Ni(P)/Au UBM with Sn-3.5Ag-xZn solders

Jee, YK; Ko, YH; Yu, Jin; Lee, TY; Cho, MK; Lee, HM, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.957 - 961, 123, 2007-05-29

2
Effect of electric field on the phase transition in ZrTiO4 ceramic

Park, Y; Lee, HM; Kim, Ho Gi, JOURNAL OF APPLIED PHYSICS, v.82, pp.1491 - 1493, 1997-08

3
Electromigration in Flip Chip Solder Bump of 97Pb-3Sn/37Pb-63Sn Combination Structure

Nah, JW; Kim, JH; Paik, Kyung-Wook; Lee, HM, TMS 2004 133rd Annual Meeting & Exhibition, pp.294, 133rd TMS Annual Meeting, 2004-03

4
SnO2 nanostructures synthesized on Co substrates

Kim, HW; Shim, SH; Hwang, HJ; Shim, JH; Cho, NH; Park, MK; Lee, HM; et al, DIFFUSION AND DEFECT DATA PT.B: SOLID STATE PHENOMENA, v.124-126, no.PART 2, pp.1289 - 1292, 2007

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