Showing results 1 to 14 of 14
Atomic layer deposition of Al2O3 thin films using trimethylaluminum and isopropyl alcohol Jeon, WS; Yang, S; Lee, CS; Kang, Sang-Won, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.149, no.6, pp.306 - 310, 2002-06 |
Characterization of CeO2 thin films as insulator of metal ferroelectric insulator semiconductor (MFIS) structures Song, HW; Lee, CS; Kim, DG; No, Kwangsoo, THIN SOLID FILMS, v.368, no.1, pp.61 - 66, 2000 |
Characterization of elastic moduli of Cu thin films using nanoindentation technique Hong, Soon-Hyung; Kim, KS; Kim, YM; Hahn, JH; Lee, CS; Park, JH, COMPOSITES SCIENCE AND TECHNOLOGY, v.65, pp.1401 - 1408, 2005-07 |
Characterization of Young's Modulus of Electroplated Cu Films using Nanoindentation Techniques Hong, Soon-Hyung; Kim, YM; Kim, KS; Hahn, JH; Lee, CS; Park, JH, International Symposium on Macro-, Meso-, Micro- and Nano-Mechanics of Materials, 2003 |
Control and modeling of stress in multi-stacked polysilicon films considering oxidation effect Lee, CS; Jang, WI; Choi, CA; Hong, YS; Lee, JH; No, Kwangsoo; Wee, DM, Micromachining and Microfabrication Process Technology IV, v.3511, pp.315 - 324, 1998-09-21 |
Control of Stress Profile Two-step Phosporus Dopping in Sueface Micromachined Polysilicon Structure No, Kwangsoo; Lee, CS; Chung, HH; Baek, KH; Lee, JH; Yoo, HJ, ISPSA, 1996-01-01 |
Damage to brittle coating layer with compliant substrate from concentrated loads Lee, CS; Kim, JH; Kim, Do Kyung, ADVANCED CERAMICS AND COMPOSITES, v.247, pp.287 - 292, 2003 |
Effect of grain boundary phase on contact damage resistance of silicon nitride ceramics Lee, CS; Lee, KS; Lee, SW; Kim, Do Kyung, ADVANCED SI-BASED CERAMICS AND COMPOSITES BOOK SERIES: KEY ENGINEERING MATERIALS, v.287, pp.421 - 426, 2005 |
Effect of tangential loading on critical conditions for radial cracking in brittle coatings Lee, CS; Lawn, BR; Kim, Do Kyung, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.84, no.11, pp.2719 - 2721, 2001-11 |
Effects of phosphorus on stress of multi-stacked polysilicon film and single crystalline silicon Lee, CS; Lee, JH; Choi, CA; No, Kwangsoo; Wee, Dang-Moon, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.9, no.3, pp.252 - 263, 1999-09 |
Fabrication and Characterization PZT/TiO2/SiO2/SiNx/SiO2/Si structure of Acousto-optic Device using Piezoelectric Film No, Kwangsoo; Lee, C; Lee, CS; Liu, J, International Symposium on Integrated Ferroelectrics(ISIF), ISIF, 2000 |
Microstructure and tensile behavior of Al and Al-matrix carbon nanotube composites processed by high pressure torsion of the powders Joo, SH; Yoon, SC; Lee, CS; Nam, DH; Hong, Soon-Hyung; Kim, HS, JOURNAL OF MATERIALS SCIENCE, v.45, pp.4652 - 4658, 2010-09 |
Plasma-enhanced atomic layer deposition of tantalum nitrides using hydrogen radicals as a reducing agent Park, JS; Lee, MJ; Lee, CS; Kang, Sang-Won, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.4, no.4, pp.17 - 19, 2001-04 |
Rate effects in critical loads for radial cracking in ceramic coatings Lee, CS; Kim, Do Kyung; Sanchez, J; Miranda, P; Pajares, A; Lawn, BR, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.85, no.8, pp.2019 - 2024, 2002-08 |
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