Showing results 1 to 6 of 6
Flip chip interconnection using anisotropic conductive adhesives for RF and high frequency applications Yim, MJ; Jung, IH; Choi, HK; Kim, K; Hwang, JS; Ahn, JY; Kwon, W; et al, 53rd Electronic Components and Technology Conference 2003, pp.1398 - 1403, IEEE, 2003-05-27 |
Formation of internal voids in tin anode with cycling Kim, R; Kim, K; Lim, S; Nam, D; Kwon, Hyuk-Sang, 218th ECS Meeting, pp.1093 -, ECS, 2010-10-10 |
In-situ Observations of Pt Nanoparticle Growth at Atomic Resolution Using Graphene Liquid Cells and Cc Correction Ercius, P; Yuk, Jong Min; Park, J; Kim, K; Lee, Jeong Yong; Zettl, A; Alivisatos, AP, Microscopy & Microanalysis 2012 Meeting, Microscopy & Microanalysis, 2012-07-29 |
In-situ Observations of Pt Nanoparticle Growth Using Aberration-corrected TEM and Graphene Liquid Cells Ercius, P; Yuk, Jong Min; Park, J; Kim, K; Lee, JY; Zettl, A; Alivisatos, AP, 18th International Microscopy Congress (IMC 2014), International Microscopy Congress, 2014-09-07 |
Influence of vacuum-annealing on the diffusion barrier properties of MOCVD TiN for Cu metallization Lee, JG; Cho, HL; Lee, E; Lee, JeongYong; Kim, K; Lee, JM, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.35, pp.S65 - S70, 1999-07 |
Lifetime enhancement of the exciton in a trapezoidal-type InGaN/GaN multi-quantum well structure Kim, K; Lee, JeongYong; Jeoung, SC, THIN SOLID FILMS, v.478, pp.286 - 292, 2005-05 |
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