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Interfacial reactions between CuxNiy alloy underbump metallurgy and Sn-Ag-zCu solders Han, H; Sohn, YC; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.36, no.5, pp.578 - 586, 2007-05 |
The Solder Joint and Runner Metal Reliability of Wafer-Level CSP(Omega-CSP) Yu, Jin; Kang, IS; Kim, JH; Park, IS; Hur, KR; Cho, SJ; Han, H, 50th Electronic Components and Technology Conference(ECTC), pp.87 - 92, 2000 |
전해도금을 이용한 Ni계 UBM 및 Sn-Ag 솔더범프 형성방법 유진; Han, H; Lee, TY, 한국 마이크로전자 및 패키징학회 심포지움, pp.84 - 87, 2003 |
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