Showing results 1 to 7 of 7
Adhesion behavior of CuCr alloy/polyimide films under 350 degrees C and 85 degrees C/85% RH environments Ahn, EC; Yu, Jin; Park, IS; Lee, Won-Jong, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.10, no.12, pp.1343 - 1357, 1996-04 |
Adhesion reliability of Cu-Cr alloy films to polyimide Ahn, EC; Yu, Jin; Oh, TC; Park, IS, Proceedings of the 1996 MRS Spring Symposium, pp.67 - 71, MRS, 1996-04-08 |
Adhesion strength of CuCr alloy films to polyimide Ahn, EC; Yu, Jin; Park, IS, Spring Meeting on MRS, v.390, pp.55 - 60, 1995-04-17 |
Adhesion study of copper and chromium films to polyimide Chung, TG; Yu, Jin; Kim, YH; Ahn, EC; Park, IS, Proceedings of the Fall 1993 MRS Meeting, v.323, pp.377 - 382, 1993-11-29 |
Cohesive failure of the Cu/polyimide system Park, IS; Ahn, EC; Yu, Jin; Lee, HY, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.282, no.1-2, pp.137 - 144, 2000-04 |
Effects of heat treatment at 350 degrees C on the adhesion of Cu-Cr alloy films to polyimide Ahn, EC; Yu, Jin; Park, IS, JOURNAL OF MATERIALS SCIENCE, v.35, no.8, pp.1949 - 1955, 2000-04 |
Effects of temperature/humidity treatments on the peel strength of CuCr alloy films on polyimide Ahn, EC; Yu, Jin; Park, IS, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.7, no.3, pp.175 - 179, 1996-06 |
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