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NEW METHOD TO IMPROVE THERMAL-STABILITY IN THE INTERFACE OF SILICON AND TUNGSTEN BY THE INTERPOSITION OF PLASMA-DEPOSITED TUNGSTEN NITRIDE THIN-FILM LEE, CW; KIM, YT; Lee, JeongYong, APPLIED PHYSICS LETTERS, v.64, no.5, pp.619 - 621, 1994-01 |
PERFORMANCE OF THE PLASMA-DEPOSITED TUNGSTEN NITRIDE BARRIER TO PREVENT THE INTERDIFFUSION OF AL AND SI LEE, CW; KIM, YT; LEE, C; Lee, JeongYong; MIN, SK; PARK, YW, JOURNAL OF VACUUM SCIENCE TECHNOLOGY B, v.12, no.1, pp.69 - 72, 1994-01 |
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