Showing results 1 to 4 of 4
Brittle Failure and Effect of Thermal Aging on Pb-free Solder Flip Chip Using Electroless Ni-P UBM Kwon,Yong-Min; Jeon,Young-Doo; Paik, Kyung-Wook; Kin, Jung-Do; Lee, Jin-Woo, ELECTRONIC MATERIALS LETTERS, v.2, no.1, pp.37 - 42, 2006-03 |
High Frequency Properties of Anisotropic Conductive Films (ACFs) for Flip Chip Package Application Yim, Myung-Jin; Paik, Kyung-Wook, ELECTRONIC MATERIALS LETTERS, v.2, no.1, pp.7 - 14, 2006-03 |
무연솔더 접합부에서의 계면 반응과 기계적 신뢰성과의 연관성에 관한 연구 = A study on correlation between interfacial reaction and mechanical reliability of pb-free solder jointlink 고용호; Ko, Yong-Ho; et al, 한국과학기술원, 2006 |
아연과 주석을 이용한 고온용 무연솔더 설계 및 특성평가 = Zn-Sn based new solder designs and reliability tests of high-temperature lead-free solderlink 문종규; Moon, Jong-Kkyu; et al, 한국과학기술원, 2011 |
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