Showing results 13 to 16 of 16
Reliable single-phase micro-joints with high melting point for 3D TSV chip stacking Tian, Ye; Fang, Heng; Ren, Ning; Zhao, Yatao; Chen, Boli; Wu, Fengshun; Paik, Kyung-Wook, JOURNAL OF ALLOYS AND COMPOUNDS, v.828, 2020-07 |
Studies on assembly and reliability of Cu/SnAg double-bump flip chip on organic substrates for fine pitch applications = Cu/SnAg 더블 범프를 이용한 미세 피치 플립칩 접속 및 신뢰성에 관한 연구link Son, Ho-Young; 손호영; et al, 한국과학기술원, 2008 |
The preparation of anisotropic conductive paste and its application in FOB interconnection Cai, Xionghui; Zhai, Aixia; Zhou, Chenglong; Paik, Kyung-Wook, MICROELECTRONICS INTERNATIONAL, v.40, no.2, pp.166 - 171, 2023-03 |
나노인덴터를 활용한 RF MEMS 스위치의 신뢰성 평가 연구 = Characterization of contact reliability in RF MEMS switch using nano-indenterlink 김동석; Kim, Dong-Seok; et al, 한국과학기술원, 2010 |
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