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Showing results 32 to 39 of 39

32
Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint

Kim, SH; Kim, JY; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.9, pp.948 - 957, 2004-09

33
Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging

Yim, Myung Jin; Li, Yi; Moon, Kyoung-sik; Paik, Kyung-Wook; Wong, C. P., JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.22, no.14, pp.1593 - 1630, 2008

34
Secondary IMC formation induced by Kirkendall voiding in Cu/Sn-3.5Ag solder joints

Kim, Sung-Hwan; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.25, no.9, pp.1854 - 1858, 2010-09

35
Shear strength of Sn-3.5Ag solder bumps formed on Ni/Au and organic solderability preservative surface-finished bond pads after multiple reflow steps

Lee, JS; Chu, KM; Jeon, DukYoung, JOURNAL OF MATERIALS RESEARCH, v.20, no.11, pp.3088 - 3093, 2005-11

36
Solid-state reactions and stress evolutions between SnAg and Ni(P) thin films

Song, Jae Yong; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.24, no.2, pp.482 - 486, 2009-02

37
Studies on solder bumps coining processes and reliability of assembled flip chip = 솔더 범프 코이닝 공정 및 플립칩 접속 후 신뢰성에 관한 연구link

Nah, Jae-Woong; 나재웅; et al, 한국과학기술원, 2004

38
Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs)

Suk, Kyoung-Lim; Choo, Kyo-Sung; Kim, Sung-Jin; Kim, Jong-Soo; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.52, no.6, pp.1182 - 1188, 2012-06

39
Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition

Jang, Jae-Won; Suk, Kyoung-Lim; Park, Jin-Hyoung; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.7, pp.1144 - 1151, 2014-07

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