Showing results 9 to 12 of 12
Numerical Analysis of the Formation of Coined Solder Bumps Hwnag, TK; Lee, SB; Nah, JW; Paik, Kyung-Wook, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging , pp.388 - 392, 3rd International Symposium on Electronic Materials and Packaging, 2001-11 |
Partial purification and characterization of thermostable esterase from the hyperthermophilic archaeon Sulfolobus solfataricus Chung, YM; Park, Chan Beum; Lee, SB, BIOTECHNOLOGY AND BIOPROCESS ENGINEERING, v.5, no.1, pp.53 - 56, 2000 |
Surface modification effects of SiC tile on the wettability and interfacial bond strength of SiC tile/Al7075-SiCp hybrid composites Park, Jongbok; Lee, Junho; Jo, I; Cho, S; Lee, SK; Lee, SB; Ryu, Ho Jin; et al, SURFACE COATINGS TECHNOLOGY, v.307, pp.399 - 406, 2016-12 |
Synthesis of LiFePO4 with fine particle by co-precipitation method Park, KS; Kang, KT; Lee, SB; Kim, GY; Park, YJ; Kim, Ho Gi, MATERIALS RESEARCH BULLETIN, v.39, no.12, pp.1803 - 1810, 2004-10 |
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