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Numerical simulation of the stress-strain curve and the stress and strain distributions of the titanium-duplex alloy Zhao, XQ; Zang, XL; Wang, QF; Park, Joong Keun; Yang, QX, RARE METALS, v.27, no.5, pp.463 - 467, 2008-10 |
Studies on the Thermal Cycling Reliability of BGA System-in-Package (SiP) with an Embedded Die Yu, Seon-Young; Kwon, Yong-Min; Kim, Jin-Su; Jeong, Tae-Sung; Choi, Seog-Moon; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.4, pp.625 - 633, 2012-04 |
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